Product category: Power Supply ICs and Controllers
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TPS2350
Edited by the Electronicstalk Editorial Team on 22 August 2003
Hot swap controller cuts its losses
A new design of intelligent hot swap controller eliminates the need for ORing diodes in redundant -48V systems
A new intelligent hot swap controller eliminates the need for ORing diodes in redundant -48V systems. The simple-to-program device, ideally suited for distributed power systems such as wireless basestations and central office switching, offers greater levels of power efficiency and performance and effectively minimises system power dissipation and voltage drop.
This article was originally published on Electronicstalk on 22 August 2003 at 8.00am (UK)
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Allowing precise control of current and voltage during turn-on and operation, TI's TPS2350 hot swap power manager operates with supply voltages ranging from -12 to -80V, and can withstand spikes to -100V.
Minimising power dissipation and voltage loss, the TPS2350 device uses two power FETs as low-voltage-drop diodes to efficiently select between two redundant power supplies.
The controller, which uses less than 10 external components, incorporates a third FET to provide hot swap load current slew rate control and peak magnitude limiting that is programmed by one resistor and one capacitor.
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Traditional diode ORing methods for connecting redundant power supplies often result in power losses and uncontrolled inrush overcurrent.
Although some limitations can be addressed with a simple hot-swap controller, the TPS2350 provides the industry's best power-efficient remedy for these issues.
Allowing a significantly less amount of power loss, TI's controller integrates programmable features such as undervoltage and overvoltage limits, circuit breaking and a fault timer, all on one device.
The low loss of power achieved through the TPS2350 greatly enhances applications designed to support PCI Industrial Computer Manufacturers Group's (PICMG) Advanced Telecom Computing Architecture (AdvancedTCA) specification.
The device also allows application developers to meet the 1% undervoltage lockout (UVLO) specifications of the AT and T Network Equipment Development Standards (NEDS v4.0) and the American National Standard (ANSI 315) for Telecommunications.
The TPS2350 is shipping in volume today in a 14-pin thin shrink small outline package (TSSOP), and is priced at $1.90 (1000-off).
Evaluation modules of the TPS2350 can be obtained in less than 24 hours through the TI power website.
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