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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 17 June 2003

Renesas to second
source compact lead-free logic

Texas Instruments has signed an alternative source agreement with Renesas Technology Corp for the advanced Pb-free logic-wafer chip-scale package, NanoFree

The arrangement increases the availability for LVC single-gate technology in the industry's smallest Pb-free logic package, NanoFree, and provides customers a firm second source for this industry standard package. Introduced by TI in 2001, the NanoStar/NanoFree package is the logic industry's smallest package providing a 70% reduction in size over the industry standard SC-70 package.

The devices available in NanoStar/NanoFree packaging are the most popular logic functions for space-constrained systems such as wireless handsets, pagers, personal digital assistants, portable DVD players, MP3 players, notebook computers, and other portable consumer electronics.

'Since NanoFree was introduced, TI has seen the adoption rate for this package increase rapidly', said David Hoover, Worldwide Product Marketing Manager for TI's Standard Linear and Logic Products.

'Our relationship with Renesas confirms a standard for this package, providing customers with a confident second source insuring continued adoption.

It was also important that we not only be aligned on the package, but that we provide the same technology for the package'.

'This package is the clear standard in the market.

Many customers have accepted the NanoFree package due to its space savings value, reliability, and ease of manufacturability', stated Yukiya Kamiya, Department Manager, Multi Purpose Linear and Logic IC Design Dept for Renesas Technology Corp.

'Aligning with Texas Instruments on this advanced packaging strategy will provide customers with the industry's premier Pb-free logic package'.

With a footprint of 1.40 x 0.9mm (1.26mm2), the 5/6 pin NanoFree package offers a 13% reduction in size from any other alternative logic package solution and a 70% reduction over the SC-70 Little Logic package.

Designers will also realise improved thermal performance with the NanoFree package over the SC-70.

This improved thermal performance benefits designers concerned with heat dissipation which is common in portable electronics.

The NanoFree package makes use of SnAgCu (tin silver copper) ball alloy and is classified per J-STD-020B (maximum reflow temperature of 250C) Pb-free parameters, however, this package reaches a maximum reflow of 260C.

With a ball pitch of 0.5mm, these self-planarising balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.

Texas Instruments currently offers single-, dual- and triple-gate Little Logic functions in LVC and AUC technologies using the NanoFree package.

Renesas will offer single-, dual- and triple-gate LVC technology in the NanoFree package.

The NanoFree packaging is fully supported with technical documentation including a WCSP Design Summary and Little Logic Selection Guide available on the TI website.

As initial NanoFree products, Renesas, has developed the HD74LVC1G series of high-speed, low-voltage Unilogic ICs sharing the specifications of TI's SN74LVC1G series high-speed, low-voltage Little Logic NanoFree products.

Initially, sample shipments of two models, the HD74LVC1G04 and HD74LVC1G97, will begin in Japan in June 2003.

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