Product category: Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 8 May 2002
Westell bases modems on TI ADSL chipset
Westell Technologies has chosen TI's ADSL chipsets to support DSL consumer deployments for its recently announced next generation of its WireSpeed products
The three new products of Westell's WireSpeed family will integrate TI's ADSL chipset technology to provide the high performance, self-install capability and interoperability required by operators, allowing them to reach more customers and provide easier installs. The new WireSpeed products are available in sleek and compact new housing and each offers fast and simple 'self-install' connectivity with superior performance and reliability.
This article was originally published on Electronicstalk on 8 May 2002 at 8.00am (UK)
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'We were very pleased with TI's AR5 chipset technology, their level of support and performance testing to provide us with a robust platform to meet the requirements of operators for residential and SOHO deployments', said Brian G Powers, Vice President, Marketing, Westell.
'This new line of WireSpeed products enables us to offer a competitively priced, self-install ADSL product family to help accelerate the DSL deployments of our customers', Powers added.
Leveraging TI's AR5 chipset family, the new Westell WireSpeed product line includes three new models: a dual connect NAT ADSL router (Model 2100) for multi-user or small business network for up to 253 users; a dual connect Ethernet ADSL modem (Model 2110) for an Ethernet or USB interface; and an Ethernet ADSL modem (Model 2000) for fast and economical 'plug and play' consumer adoption.
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'We are excited that Westell has chosen our ADSL technology to provide the high-performance features and interoperability needed for large-scale deployments to operators and consumers in North America', said Greg Jones, General Manager of TI's DSL Business Unit.
'Our ADSL technology combined with our support and testing efforts is making TI's AR5 chipsets one of the most complete and robust platforms to build on for ADSL CPE'.
At the heart of Westell's WireSpeed line is TI's AR5 consisting of TI's two-chip physical layer chipset and broadband communications processor to provide the extended rates and reach and self-install ADSL technology needed for consumer adoption.
To support nationwide deployments, TI has spent thousands of man-hours in physical layer interoperability testing to ensure that Westell's modems will meet the requirements of the LECs.
Additionally, the integration of TI's AR5 enables Westell to offer smaller CPE modems at competitive prices to extend their presence in the DSL market.
Westell's new WireSpeed products are expected to ship to customers in June and are currently undergoing testing in customer labs.
The modems will be featured at Supercomm 2002, 4th-6th June at the Georgia World Congress Centre in Atlanta.
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