Product category: Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TCS2500 chipset
Edited by the Electronicstalk Editorial Team on 29 October 2001
Antenna-to-applications solution for 2.5G devices
Texas Instruments says its latest chipset provides wireless device manufacturers with a complete 'antenna-to-applications' solution and reference design for 2.5G mobile devices
TI's OMAP platform technology lies at the heart of the chipset and is the first processor to integrate a GSM/GPRS modem and a dedicated applications processor on a single chip that supports next-generation, bandwidth-intensive wireless applications. The programmable DSP-based TCS2500 chipset leverages the OMAP710 processor to enable services such as multimedia messaging, short video clip and Internet audio downloads, e-mail, real-time web browsing and games.
This article was originally published on Electronicstalk on 29 October 2001 at 8.00am (UK)
Related stories
Changing wireless landscape explained
TI will showcase the latest mobile products that enable its customers to innovate in a world driven by demand for on-the-go entertainment and productivity at CTIA Wireless 2006
Webcast to address wireless power optimisation
Texas Instruments and Avnet Electronics Marketing will present a live Analog eLab webcast on 'Optimising power in low-power wireless systems' on 12th April 2006
Building on the benefits of TI's TCS2100 GPRS chipset announced in June 2001, the new TCS2500 chipset combines the OMAP710 processor with TI's leading analogue baseband and RF technology to offer a comprehensive silicon and software offering.
Tailored specifically for 2.5G smart phone and PDA devices, the TCS2500 chipset adds to TI's growing family of GPRS solutions.
Wireless device manufacturers can significantly reduce cost and form factors over current smart phones and PDA implementations due to the integration in the TCS2500 chipset.
At the same time, the chipset allows new systems to maintain low power and performance comparable to today's voice-centric 2G wireless phones.
Also important for wireless device manufacturers, TI's TCS2500 solutions includes the key building blocks for quickly and easily developing 2.5G devices: a GSM/GPRS digital baseband processor, which includes dedicated applications functionality, analogue baseband and RF companion chips, plus complete software solutions including protocol stacks.
Further reading
Gigabit Ethernet transceiver is flexible interface
A six-channel gigabit Ethernet transceiver provides a full-featured, flexible interface in datacommunications and telecommunications equipment
Bluetooth and FM coexist in harmonious RF chip
The BlueLink 6.0 platform combines the industry's best performance Bluetooth wireless technology with high fidelity FM stereo and mono performance on a single chip
Driver masters analogue signalling
A digitally controlled current/voltage output driver is designed for industrial applications such as industrial PLCs and process control equipment
At the core of the solution is TI's OMAP710 processor that incorporates a DSP-based GSM/GPRS digital baseband engine and an ARM9 microprocessor with integrated MMU and cache for complete modem and applications support.
As part of TI's OMAP family of flexible, open processors, the OMAP710 features full support of advanced mobile operating systems such as Microsoft's Windows CE, PalmOS, symbian OS and Linux.
In addition, the OMAP710 provides Java programming support and gives wireless device manufacturers access to a network of application developers who are actively creating applications for the OMAP platform.
The OMAP710 processor is code compatible with TI's OMAP1510 processor and other future OMAP wireless products.
This allows designers building products on one processor to quickly and easily port code to another, saving significant engineering resources for manufacturers.
Other devices in the TCS2500 chipset include the TWL3012 analogue baseband and the TRF6150 RF IC.
The TWL3012 combines voiceband and baseband codecs with single- and multi-slot IQ RF interfaces, and auxiliary RF convertors into a highly integrated device.
The TRF6150 is a highly integrated RF IC based on an advanced direct conversion architecture, yielding bill of materials (BOM) reductions of about 30% versus competitive super heterodyne architectures.
The TCS2500 chipset includes a full array of software development tools as well as a complete OMAP710-based reference design that together can reduce development time by more than half a year.
The reference design includes the complete BOM, board design and layout, a fully type-approved reference design, best-in-class and worldwide customer support and access to a complete GSM/GPRS Layer 1, 2 and 3 stack.
The reference design is a complete 2.5G wireless system solution that is ready to be manufactured and put into final plastics.
The TCS2500 chipset is sampling to customers today and will begin shipping before the end of 2001.
• Texas Instruments (April 2001-March 2006): contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
•
• Electronicstalk Home Page
Related Business News
Usb/ac Battery Charger Ics Support Charge...
...Currents Up To 1 A .. Specified for -40 to +85degC temperature range, USB/AC battery charger ICs are suited for portable systems operating off single-cell 4.2 V Lithium Ion/Polymer batteries.
Japan's Kansai Elec sees no boost in energy imports
Tokyo, Sept 5 (Reuters) - Japanese utility Kansai Electric Power Co Inc said on Wednesday it has no plans to boost energy imports or restart its decommissioned thermal plants to cope with an unplanned shutdown of its nuclear unit.
Major Challenges and Issues Facing the...
...Medium-Small Sized Touch Panel Industry. Reportlinker.com announces that a new market research report related to the worldwide components industry is now available to its catalogue.
Smart Sensor Solution for Automotive Electronics Industry by VTI
The new VTI automotive digital accelerometer family has been designed to support the trend towards intelligent integration and smart sensing combined with improved reliability and sophisticated self-test features.
Maxscend Technologies to Showcase Latest DAB/DAB+/DMB...
...Solution at IBC 2007. Maxscend Technologies, a leading mobile DTV chip solution provider, will be showcasing its MXD0120, the DAB/DAB+/DMB demodulator with the lowest power consumption in the industry, as well as being the smallest in size, at the International Broadcasting
Search the Pro-Talk network of sites
