Product category: Reference Designs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: Symbian-based wireless devices
Edited by the Electronicstalk Editorial Team on 4 June 2001
Faster route to
wireless device development
The development of next generation (2.5 and 3G) wireless smartphones has become easier since Texas Instruments and Atelier unveiled a platform for Symbian-based wireless devices
The development of next generation (2.5 and 3G) wireless smartphones has become easier for handset manufacturers since Texas Instruments and Atelier unveiled a wireless hardware and software platform for Symbian-based wireless devices. Leveraging TI's DSP-based OMAP family of processors, combined with Atelier's BC2 suite of wireless phone software components, wireless handset manufacturers will rapidly develop, test and deliver GSM, GPRS and 3G smartphones faster to market with enhanced system performance and battery life for wireless applications including multimedia messaging, audio and video streaming, e-mail, m-commerce and interactive gaming.
This article was originally published on Electronicstalk on 4 June 2001 at 8.00am (UK)
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'By combining TI's DSP-based OMAP platform with Atelier's wireless phone software expertise, next generation mobile device developers will be able to take advantage of state of the art technology to produce compelling Symbian-based wireless information devices in record time', said Jeremy Copp, Vice President, Business Relationships, Symbian.
'This combined hardware and software platform will enable handset manufacturers to deliver a wide range of devices in a greatly reduced timeframe'.
TI's programmable DSP-based OMAP architecture, unveiled in May 1999, delivers advanced wireless Internet and multimedia functionality without compromising battery life essential to wireless communications devices.
TI's OMAP architecture is not only architected to support all 2G, 2.5G and 3G wireless standards, but also delivers an open software environment to provide new applications for wired and wireless downloading.
TI's OMAP platform is supported by a broad network of developers who design popular applications including multimedia, security, m-commerce, gaming and location based services, in addition to TI's Code Composer Studio Integrated Development Environment and eXpressDSP-compliant algorithms.
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'Next generation wireless smart phones will be required to deliver the best of all worlds - high levels of performance, long battery life, and a multitude of dynamic, user friendly applications and services in a sleek handheld design', said Paul Werp, TI OMAP Platform Worldwide Marketing Manager.
'By working with wireless leaders including symbian and Atelier, handset manufacturers will possess the critical building blocks to deliver leading edge wireless devices and applications'.
Atelier's BC2 Mobile Phone Software is highly optimised for TI's high performance, DSP-based OMAP platform.
Atelier's BC2 mobile phone software can be used at any stage of the development of a new wireless device and provides handset manufacturers with all the necessary phone software components to rapidly prototype, design and implement the telephony part of a 2.5 or 3G communicator or smartphone.
Complete wireless solutions using TI's OMAP processors and Atelier's BC2 mobile phone software are available today for wireless handset development.
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