Product category: Frequency Control Components
News Release from: Temex | Subject: RF SAW filters in CSP
Edited by the Electronicstalk Editorial Team on 19 February 2003
SAW filters shrink
to chip-scale packaging
A new ultracompact range of RF SAW filters uses chip-scale packaging specifically to address the demanding miniaturisation and performance requirements for new generations of mobile phones
New ultracompact RF SAW filters, that use chip-scale packaging specifically to address the demanding miniaturisation and performance requirements for new generations of mobile phones, have been announced by Temex Microsonics at 3GSM. Temex Microsonics' new RF SAW filters support all the major standards: EGSM, DCS, AMPS/CDMA/GSM850, PCS, WCDMA, WLAN/Bluetooth, within the standard range of devices, offering a cost-effective solution for all applications.
This article was originally published on Electronicstalk on 19 February 2003 at 8.00am (UK)
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For each device, package size is 2.0 x 1.4 x 0.82mm maximum, as a result of the use of innovative chip-scale packaging by Temex.
The devices offer a balanced output to improve signal sensitivity.
Key features of the range include compatibility with lead-free (high-temperature) solder reflow while achieving high reliability against moisture, temperature, mechanical vibrations and shocks.
Temex Microsonics is offering samples now, mounted if required on ready-to-use evaluation boards.
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