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News Release from: Teradyne
Edited by the Electronicstalk Editorial Team on 4 April 2005

Novel X-ray technology promises a clearer view

Teradyne is claiming an innovative breakthrough in 3D X-ray imaging technology for detecting PCB solder and production defects.

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Teradyne is claiming an innovative breakthrough in 3D X-ray imaging technology for detecting PCB solder and production defects. Paul Groome, Manager of Teradyne's AXI Products Group, said: 'The beauty of our ClearVue X-ray technology lies in the increased quality, efficiency and simplicity it brings to automated X-ray inspection'. 'Both quality managers and production line controllers will benefit from its unique ability to identify material issues more quickly and with absolute certainty'.

Using a patented off-centre tomosynthesis imaging technique, the ClearVue X-ray technology is ideally suited for densely packed single or double-sided boards that use BGA-style components and when loss of electrical or optical access is problematic.

compared with laminography and other 3D X-ray techniques, ClearVue X-ray technology's superior image clarity, diagnostic capabilities and full board coverage better exposes solder (including lead-free) flaws that are otherwise overlooked.

More importantly, ClearVue X-ray technology is expected to enable Teradyne to manufacture and sell the industry's highest fault coverage inline X-ray test and inspection solutions.

ClearVue operates using a stationary X-ray source and detector and, unlike conventional 3D X-ray test systems, does not require complex or rotating mechanical parts.

The result is significantly lower false call rates (promising up to 40 times improvement over existing 3D X-ray solutions); improved reliability, better repeatability and improved cycle times.

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