Sensitive chipsets take position in GPS modules

Tyco Electronics Power Systems is to release a family of GPS module products based on SiRF's award winning SiRFstarIII architecture.

Tyco Electronics Power Systems has joined the SiRF Technology Value Added Manufacturer (VAM) programme, and will release a family of GPS module products based on SiRF's award winning SiRFstarIII architecture.

The first of Tyco Electronics' SiRF-based modules, the A1080, will be released in Q4 2006 and available through Tyco's global sales channels.

The A1080 features the GSC3/LP, the low-power single-chip implementation of the SiRFstarIII architecture.

Tyco Electronics selected SiRF as the GPS technology to power its new module family because of SiRF's industry leading performance and strong global brand recognition.

SiRF extended its coveted VAM status to Tyco Electronics based on Tyco Electronics' module design experience and history of success in telematics, asset tracking and automotive electronics markets.

With SiRF's latest generation of high sensitivity GPS chipsets, Tyco Electronics' SiRF-based modules are conceived to offer best-in-class time-to-first-fix (TTFF) and sensitivity in small form factor modules suitable for both automotive and consumer markets.

"SiRF's GPS chipsets work amazingly well in challenging weak signal environments", said Hans Wiedemann, Manager of Product Marketing for Positioning Products at Tyco Electronics Power Systems.

"We see great potential for SiRFstarIII modules in our traditional telematics and automotive markets as well as emerging opportunities in the consumer electronics segment".

"SiRF is pleased with Tyco Electronics' decision to join the SiRF VAM program" said Dennis Sheehan, Director of Product Management at SiRF Technology".

"We recognise Tyco Electronics' strong engineering heritage and their excellent track record of designing and manufacturing high quality module products.

We welcome them as the newest SiRF VAM".

The Tyco Electronics modules based on SiRF chipsets will be designed by Tyco Electronics Power Systems in Germany and manufactured at multiple Tyco Electronics TS16949-certified factories in the European Union.

The entire Tyco Electronics line of SiRF-based module products will be RoHS compliant and will be 100% electrically and functionally tested prior to shipment.

SiRF's VAM program is designed to enable the fast integration of SiRF latest GPS chipset technology into fast time to market full function GPS modules suitable for consumer, industrial automotive and wireless applications.

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