Compound boasts high thermal conductivity

Novel thermal transfer compound is particularly suited to many electrical and electronics applications.

Steadlands International has extended its thermal management range with the addition of a novel thermal transfer compound.

TCG is formulated with selected polydimethyl siloxane fluid and metallic oxide fillers resulting in a paste that has extremely high levels of thermal conductivity.

This along with its high relative permittivity and high dissipation factors, makes it particularly suited to many electrical and electronics applications.

Conforming to the MIL-C-47113B guidelines, TCG has a thermal conductivity of 0.9W/mK, a relative permittivity of 4.81 and a dielectric strength of 22kV/mm.

Volume resistivity is 1.2x10e-15ohm/cm and 60x worked penetration is 240-320.

TCG has a shelf life of 12 months at 25C and can be used in ambient operating temperatures from -55 to +220C.

The compound is available in 30cm3 barrels to fit the dispensing gun or EFD type timed dispensers.

It can also be supplied in 1, 5 or 25kg pails.

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