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News Release from: Surface Technology Systems
Edited by the Electronicstalk Editorial Team on 12 September 2005

Platform accelerates wafer throughput

The CPX cluster platform enables multiple process chambers to share a common wafer transport system.

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New from Surface Technology Systems, the CPX cluster platform enables multiple process chambers to share a common wafer transport system. Designed to reduce the cost for mass production of devices used in end markets such as printer inkjet heads and wireless communications, CPX extends the full suite of platforms that support STS' range of advanced process modules, offering easy process transfer from research and development to full-scale production. CPX provides a single wafer automation platform to service up to four STS plasma process modules, thus reducing the overall cost of the system by reducing fab footprint, operator cost and equipment cost.

Clustering process modules on a common platform reduces the capital equipment cost by up to 60% by sharing common components needed for wafer transport.

CPX will be particularly well suited to the mass production markets in fabs and foundries where manufacturers are focused on minimising the cost per wafer by increasing productivity and reducing capital equipment investment and running costs.

Building on extensive experience of manufacturing cluster systems for over 10 years, and with an installed base of over 120 cluster systems, STS has chosen the Brooks Marathon Express MX600 automation platform as the backbone of the new system due to its 'best in class' reputation, coupled with Brooks' worldwide support.

The new cluster has also been updated with STS' advanced PLC control system, already successfully proven on their single chamber systems.

The CPX, with twin vacuum cassettes and integrated wafer alignment, is compatible with all STS process technologies, and offers advantages over eight-sided platforms in terms of footprint.

At the same time the system provides very high production throughput - the result of Brooks vacuum automation technology coupled with STS' high rate process technology.

'The launch of the CPX utilising Brooks Marathon Express automation enables STS to provide a high reliability production platform for manufacturing requirements in markets such as MEMS, advanced packaging and data storage', observed John Saunders, STS CEO.

'We can now not only provide the most advanced process technology to our customers, but also offer a world-class automation platform for the high wafer processing throughput and low cost of ownership that is required now and into the future'.

STS has already taken multiple orders for CPX systems from major production companies in the USA.

The company believes that the new tool, coupled with its leading edge process technologies such as advanced silicon etch (ASE) and advanced oxide etch (AOE), strengthens the company's position in our served markets.

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