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Product category: Power Supply ICs and Controllers
News Release from: Semikron | Subject: MiniSKiiP
Edited by the Electronicstalk Editorial Team on 19 July 2007
Power modules come with thermal paste
applied
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Automatic screen-printing process provides optimal coverage, ensuring power modules mate perfectly with heatsinks.
Semikron can now supply its power modules with thermal past ready applied The optimum application of thermal paste onto the semiconductor module ensures good thermal performance once the module is assembled on the heatsink
This article was originally published on Electronicstalk on 11 Jun 2007 at 8.00am (UK)
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