X-ray analyser measures trace amounts of metal

A Seiko Instruments product story

Edited by the Electronicstalk editorial team Jan 21, 2009

SII Nanotechnology has introduced the SEA6000VX - an energy dispersive fluorescent X-ray analyser for high-speed, high-sensitivity measurement of trace amounts of metal in micro-spots.

The SEA6000VX is equipped with the Vortex detector, a liquid-nitrogen-free semiconductor detector with a high count rate, and a new X-ray generating system design.

It is an incoming and outgoing inspection instrument that can help decide whether or not components and products comply with environmental regulations such as the RoHS Directive.

With environmental directives such as ELV and RoHS and additional trends toward lead-free and halogen-free in toys and RPF, the need to measure environmentally regulated substances continues to spread.

There have been demands for improvements to measurement efficiency and solutions for complicated measurements.

One of these demands has been the ability to measure specific parts on assembled PC boards without disassembling components.

The SEA6000VX enables high-speed measurement of these micro-spots on boards with improvement in sensitivity.

This allows for the management of harmful substances over the entire board.

Previously, measurements of trace hazardous substances had to be conducted in relatively large analytical areas (about 5mm - 10mm) in order to generate enough intensity for an accurate measurement.

Smaller collimated areas (about 0.5mm - 1.2mm) required longer measurement time.

With the SEA6000VX's improved sensitivity, these measurements can now be conducted in much smaller areas in the same measurement time or less.

When combined with a high-speed electric stage, this sensitivity enables high-speed 2D elemental mapping.

The SEA6000VX can detect lead solder of sub-millimeter size in a 100mm2 area of an assembled PCB in approximately two minutes.

Increasing the frequency of mapping allows lead detection at the 1000ppm regulatory level of this entire area in approximately 30 minutes.

With the super-imposed image overlaid onto the camera image of the area, the inspection team can determine whether the entire assembled printed circuit board is lead free.

The optical system allows high-resolution observation to locate a measurement site with the help of an accurate moveable stage.