HTC material for low loss in high-power circuits

Rogers has introduced RT/duroid 6035HTC, a high-thermal-conductivity (HTC) laminate material engineered for low loss in high-power circuits.

The fluoropolymer composite material is ideal for RF and microwave applications in military and high-reliability (hi-rel) applications required to handle high power levels, such as power amplifiers.

Rogers RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10GHz, making them suitable for a range of circuits, including amplifiers, couplers, filters and power combiners/dividers employed in avionic and other military and hi-rel systems.

The laminates incorporate a filler material to achieve strong heat-transfer characteristics.

RT/duroid 6035HTC laminates exhibit thermal conductivity of 1.44W/mK as well as low loss, with a loss tangent of 0.0013 at 10GHz, resulting in excellent heat transfer away from high-power devices, such as transistors, for improved circuit and device reliability.

RT/duroid 6035HTC laminates are fabricated with thermally stable, reverse-treated and electrodeposited copper foils.

These low-profile copper foils help minimise conductor losses in high-frequency circuits, with the thermal stability needed for high reliability in high-temperature applications, even at the power levels found in many military electronic-warfare (EW) and commercial communications systems.

RT/duroid 6035HTC laminates are formulated for ease of processing.

The filler material in RT/duroid 6035HTC supports clean drill holes with minimal tool wear compared with alumina, for noticeably longer drill-bit lifetimes and higher drill-hole repeatability in volume production applications.

The RT/duroid 6035HTC laminates are available in a variety of dielectric thicknesses and cladding options to support a range of high-frequency circuit applications.

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