News Release from: Raychem Circuit Protection
Edited by the Electronicstalk Editorial Team on 11 May 2005
ESD protection devices come in popular outlines
Raychem Circuit Protection continues to expand its circuit protection portfolio with a new range of electrostatic discharge (ESD) protection devices.
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Raychem Circuit Protection continues to expand its circuit protection portfolio with a new range of electrostatic discharge (ESD) protection devices. Designed for I/O port protection on USB 2.0, IEEE1394, digital visual interface (DVI) and antenna switches, the PESD0402 and 0603 protection devices are available in the electronics industry's most popular form factors. The RoHS-compliant devices shunt ESD away from sensitive circuitry in HDTV equipment, printers, laptops, cellular phones, and other portable devices.
Raychem Circuit Protection maintains its position as the industry leader in circuit protection with ESD devices that utilise advanced thick film technology to provide exceptionally low capacitance (typically 0.25pF) for ESD protection in high-speed data transmission applications.
The devices perform better than other comparable components in transmission line pulse (TLP) testing, a typical ESD performance evaluation.
They also offer lower trigger and clamping voltages than typical polymeric ESD devices, resulting in improved protection of sensitive electronic components.
The ESD series also performs better in IEC61000-4-2 testing, especially after multiple hits (up to 1000).
'The new ESD protection devices provide low capacitance, low-voltage clamping levels, and high ESD tolerance - all critical performance parameters for high data-rate transmission applications', said Theresa Lagos, Product Marketing Manager.
'Additionally, the device's form factor meets the board-space and surface mount installation requirements of new portable electronics designs'.
The ESD series devices are available in standard EIA sizes 0402 and 0603, with a quad-array in 1206 size coming soon.
They are compatible with standard surface-mount and reflow installation procedures, and are available in tape and reel packaging for compatibility with high-volume manufacturing.
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