Power conversion IC for low-profile applications

Power Integrations has announced the availability of its Topswitch-JX power conversion IC in an eSOP low-profile power package for applications such as slim LCD TV auxiliary power and PC standby.

The slender surface-mount package is suitable for applications without heatsinks up to 65W in compact, open-frame installations.

This includes set-top boxes and DVD players.

In notebook, netbook and printer adapters, the thermally efficient eSOP package can supply up to 40W using only the PCB for thermal management.

The eSOP package features an exposed die-attach pad that may be reflow soldered to the PCB during assembly.

This permits the copper ground plane and thermal mass of the board to act as a heat sink.

The 12-pin package occupies a footprint measuring119m2, yet maintains safety creepage and clearance distances required by international standards and permits use in offline applications.

Topswitch-JX ICs incorporate both a PSU flyback controller and a 725V Mosfet power in a single package, and feature a multi-mode control algorithm that maximises power efficiency across the entire load range.

High efficiency at full power minimises power wasted during normal operation and reduces the complexity and expense of thermal management on the system.

At low power levels, high efficiency enables adapters with low no-load consumption and maximises power available to the system in standby mode for applications constrained by standards and regulatory controls.

Good light-load efficiency and low power consumption in the no-load condition are facilitated by a multi-cycle modulation mode that reduces the average switching frequency while minimising output ripple and audible noise.

This allows designs to meet efficiency specifications such as Energy Star and the European Ecodesign Directive while maintaining a stable output voltage.

Standby power consumption of 85mW (for a 20mW load) at 264VAC is achieved using Topswitch-JX.

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