Click on the advert above to visit the company web site
Product category: Microprocessors, Microcontrollers and DSPs
News Release from: NXP Semiconductors
Edited by the Electronicstalk Editorial Team on 05 February 2007
Chinese joint venture to test and
package ICs
Request your FREE weekly copy of the Electronicstalk email newsletter. News about Microprocessors, Microcontrollers and DSPs and more every issue. Click here for details.
NXP Semiconductors and Advanced Semiconductor Engineering are forming a joint venture in Suzhou, China focused on semiconductor testing and packaging.
NXP Semiconductors and Advanced Semiconductor Engineering have signed a memorandum of understanding to form a joint venture (JV) in Suzhou, China focused on semiconductor testing and packaging It is planned that NXP will hold a 40% share and ASE will hold the remaining 60%