Product category: Communications ICs (Wireless)
News Release from: NXP (formerly Philips Semiconductors)
Edited by the Electronicstalk Editorial Team on 7 January 2003
Pair to target
ultrawideband wireless comms
Philips and General Atomics have signed a memorandum of understanding to jointly develop ultrawideband (UWB) wireless communication chipsets and support the standardisation process
The result of the collaboration will provide a significant time-to-market advantage for the introduction of UWB chipsets. Initial chipsets are expected to be available in conjunction with emerging standards such as IEEE802.15.3a. UWB, a high-speed, short-range wireless technology, is ideal for effortlessly transferring digital content between devices in different entertainment and computing clusters in the home, such as digital video recorders, set-top boxes, televisions and personal computing peripherals.
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Philips and GA intend to leverage one another's expertise to offer high-performance and cost-effective UWB solutions for consumer and computing applications.
GA will benefit from Philips' leadership in RF and its proven QUBiC semiconductor process technology.
Philips will license GA's wireless communication technology, including its Spectral Keying, an advanced multiband UWB technology.
Further reading
EDGE mobile phones built around Nexperia platform
China's biggest mobile-handset maker is using NXP technology to develop cost-effective EDGE phones for the Chinese market, which currently consists of 400 million subscribers
Together, the focus is to develop wireless communication chipsets for very-high-bitrate networks, up to 480Mbit/s.
"GA is pleased to collaborate with Philips and be able to leverage its world-class, highly advanced silicon BiCMOS process technology", said Dr Michael D Perry, Director, General Atomics.
"Combined with GA's UWB technology and Philips' RF leadership and heritage as a consumer company, we intend to develop robust semiconductor solutions targeting this emerging short range wireless technology space".
"The relationship with GA reinforces Philips' commitment to offer consumers cost-effective wireless connectivity solutions of the future", said Phil Pollok, Senior Vice President of Emerging Businesses Unit, Philips Semiconductors.
"By working with GA to develop UWB chips, Philips is bolstering its solutions for high data rate applications and is maintaining its leadership in promoting standards for a breadth of wireless communications technologies".
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