Process combines SiGe with CMOS logic and more
A NXP Semiconductors product story
Edited by the Electronicstalk editorial team Mar 21, 2002
A new semiconductor process combines ultra-high-speed SiGe technology with passive component integration, substrate isolation and dense CMOS logic capabilities.
A new semiconductor process combines ultra-high-speed SiGe technology with passive component integration, substrate isolation and dense CMOS logic capabilities.