Product category: Microprocessors, Microcontrollers and DSPs
News Release from: NXP (formerly Philips Semiconductors)
Edited by the Electronicstalk Editorial Team on 5 February 2002
Philips and MobileEye
in automotive SoC accord
Work is under way to develop a highly integrated SoC solution for automotive driver assistance applications, taking the first step towards the development of autonomous driving systems
Philips Semiconductors has formed a strategic partnership with MobilEye to manufacture a highly integrated SoC solution for automotive driver assistance applications, taking the first step towards the development of autonomous driving systems. Philips Semiconductors and MobilEye will leverage their respective expertise in IC creation and driver assistance systems to develop an ASIC design for applications such as adaptive cruise control to maintain safe headway distance in cruise-control mode, lane departure warning, forward collision warning, and sensory fusion applications for collision mitigation and active safety.
This article was originally published on Electronicstalk on 5 February 2002 at 8.00am (UK)
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Following on from Philips Semiconductors' leading role in the Safe-by-Wire and FlexRay consortiums, this announcement strengthens the company's position as a leader in the development of automotive safety, autonomous driving and x-by-wire systems, respectively.
"This is a great development in bringing active safety devices into the car", said Pascal Langlois, vice-president for Philips Semiconductors' Global Market Segment Automotive.
"We are delighted to have teamed up with MobilEye to really speed development of cost-effective electronic safety systems which will ultimately make the driving experience far safer.
Additionally, the ASIC SoC represents some key technological challenges which Philips Semiconductors and MobilEye are happy to resolve".
"We are jointly developing an ASIC SoC of extreme importance for the automotive market", said Siv Aviram, president and chief executive of MobilEye BV.
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"Philips Semiconductors is a leading player in automotive electronics and ASIC SoC and we were extremely keen to work with them on this project.
Together we are confident of being able to bring this key automotive safety development to the mass market, with fast production times".
The System-on-Chip solutions will deliver computationally intense (ie intense real-time calculation) applications for real-time visual recognition and scene interpretation, customised for use in intelligent vehicle systems.
The chip architecture is designed to maximise cost performance by having a Fully fledged application, such as a low-cost version of adaptive cruise control from a single video source, on a single chip.
The system, using sensors, can enable intelligent interpretations of the visual field such as detecting vehicles, pedestrians and road signs to provide an intelligent driver assistance system.
Even though the chip architecture is designed to have a fully-fledged application on a single chip, it is sufficiently flexible and programmable to accommodate a wide range of visual processing applications outside of the automobile.
The pattern classification module is application-specific yet at the same time based on general principles, which can accommodate other classes of objects such as human faces and pedestrians.
The automotive applications provide a rich context for deploying this architecture due to the growing need to have sensors that can enable intelligent interpretations of the visual field such as detecting vehicles, pedestrians and road signs.
However other nonautomotive applications would soon become relevant such as home entertainment and surveillance systems.
The SoC functional capabilities include proprietary pattern identification techniques for segmenting out vehicles from the background scene under static and dynamic conditions; visual motion analysis techniques for isolating dynamically moving patterns such as passing and crossing vehicles and for estimating the host vehicle's yaw and pitch rates; and image processing techniques for lane following and road path prediction.
Unlike conventional approaches, the technological architecture is designed to deliver the full range of capabilities from a monocular (single camera) video stream (in visible or IR spectrum), yet the chip architecture is designed to accept multiple sensory inputs, such as millimetre-wave or laser radar vehicle tracks for sensory fusion applications.
The SoC architecture offers a high level of cost performance with the target of reaching high volume penetration to the growing market of intelligent onboard driving assistance systems.
The architecture includes multiple ARM946 programmable central microprocessors for driving general purpose computations and application-level programming and four application-specific modules for image pre-processing, motion analysis, pattern recognition, and lane following.
The architecture includes 2.2Mbit of on-chip SRAM for efficient image memory management.
To maximise cost performance, peripheral circuits are integrated, including dual CAN, PROM, and SDRAM controllers, parallel I/O, and image data input units.
The SoC will be manufactured using the leading CMOS 0.18-micron technology, as installed in several Philips-owned wafer fabs.
The product will receive full cabin-grade automotive qualification.
First silicon samples are to be released for testing by end of 2002 with the target to be deployed on 2005 car models.
(This was Electronicstalk's Top Story on 5 February 2002)
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