Product category: Design and Development Software
News Release from: Polyteda Software Corporation
Edited by the Electronicstalk Editorial Team on 8 August 2006
Partnership programme advances SiP education
Polyteda Software Corporation has set up an academic partnership programme (APP) for establishing direct contacts with the academic community
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Partnership programme aids SiP designers
Polyteda Software Corporation has set up its Initial Strategic Partnership Programme (ISPP)
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This is the second partnership programme introduced by the company, following the ISPP for commercial design companies. System-in-package (SiP) is a relatively new manufacturing technology that is still in its developing stage. There are no training programmes or courses dedicated specifically to SIP designs.
At the same time, beside traditional aspects of packaging designs, the technology involves wide range of highly complex multiphysics processes that have to be taken in consideration.
The partnership programme addresses this issue.
The company is ready to provide support for academic environments in developing specific SiP curricula.
As a first step, Polyteda offers a beta-version of Skyscraper 1.0b, its integrated EDA tool for system-in-package design, free of charge.
The product can be used as a base for curricula on SiP technology.
In return, the company expects to receive feedback from participating universities.
The results will be combined, analysed, and used for improvement of the product, including adjustments required for education processes.
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