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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Palmchip Corporation
Edited by the Electronicstalk Editorial Team on 11 August 2003

Patent validates SoC technology

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The US Patent and Trademark Office has awarded Palmchip Corp a key patent for its technology facilitating the easy connection of IP blocks within a system on chip design

The patent (US Patent No 6,601,126), titled "Chip-core framework for systems-on- a-chip", will protect the company's technology for building system on chips using a unidirectional bus structure enabling point-to-point connectivity for internal SoC IP cores. This technology was initially introduced to the chip design community through the company's CoreFrame SoC architecture.

The CoreFrame SoC architecture is used in Palmchip's two SoC platform products, PalmPak and the flagship AcurX platform.

Both platforms are configurable and are tested, preverified and silicon proven.

"This favourable decision from the US Patent and Trademark Office represents a significant milestone in our company's history", said Jauher Zaidi, President and CEO of Palmchip Corp.

"The granting of this patent validates our SoC technology leadership and reflects our history of innovation in system on chip platform design in addition to protecting our intellectual property".

"We believe that this patent grant could have a wide-ranging impact on those companies who have created SoC devices or marketed SoC platforms using unidirectional busses as a method of assembling separate IP blocks within a design", said Jim Venable, vice president of Palmchip.

"It is our intention to aggressively protect our intellectual property by making the technology available under licence to those companies wishing to use it".

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