Click on the advert above to visit the company web site
Product category: IC and Hybrid Processing Equipment
News Release from: Oxford Instruments Plasma Technology | Subject: TEOS delivery module
Edited by the Electronicstalk Editorial Team on 05 January 2007
Delivery module enhances deposition
tools
Request your FREE weekly copy of the Electronicstalk email newsletter. News about IC and Hybrid Processing Equipment and more every issue. Click here for details.
Oxford Instruments has developed a new TEOS delivery module for plasma-enhanced chemical vapour deposition of silicon dioxide in its PlasmalabSystem100 and PlasmalabSystem133 deposition tools.
Oxford Instruments has developed a new TEOS delivery module for plasma-enhanced chemical vapour deposition (PECVD) of silicon dioxide (SiO2) in its PlasmalabSystem100 and PlasmalabSystem133 deposition tools TEOS (tetraethoxysilane, tetraethyl orthosilicate) offers an alternative PECVD precursor to the commonly-used silane (SiH4) for applications such as photonics and dielectric layers in which high quality, conformal deposition of SiO2 is required