News Release from: Omron Electronics
Subject: XF2B
Edited by the Electronicstalk Editorial Team on 16 April 2002
Ultra-slim FPC connector saves space and time
Omron has an ultra-low-profile connector for FPC/FFC applications, reducing total height to 1.2mm above the board.
Note: A free brochure or catalogue is available from Omron Electronics on the products in this news release. Click here to request a copy.
Omron has an ultra-low-profile connector for FPC/FFC applications, reducing total height to 1.2mm above the board. Despite its low profile, the 0.3mm pitch Omron XF2B features twin contacts to provide a stable connection force and relieve the need to distinguish between upper and lower FPC contacts during assembly. In common with other Omron XF series connectors, the new XF2B connector features a convenient rotary slider that is locked shut after insertion of the FPC.
Supplied in the open position, the slider does not need to be released before insertion, and the FPC is held in a four-shrouded housing that prevents displacement as the slider is operated.
Combined with the double sided contact design, this ergonomic insertion and locking scheme reduces assembly costs and also minimises end of line faults caused by connector errors.
Insertion tolerance is 20 insertions.
The XF2B is initially available in a 39-pole version for applications including digital cameras, palmtop and laptop PCs, cellular handsets and other lightweight, portable electronic products.
The connector is rated for 0.5A applications up to 50V DC, and achieves low contact resistance of 30mohm.
Withstand voltage is 250V AC for 60s, and the connector is rated for continuous operation up to 85C while maintaining contact resistance under 50mohm.
The housing and slider are moulded in PA46 and LCP resins meeting UL94V0 that achieve 100mohm insulation resistance.
Mechanically robust design withstands shocks up to 5g during operation, with current interruptions less than 1us and 50mohm maximum post-event contact resistance.
The Omron XF2B is compatible with reflow soldering processes up to 240C peak temperature, and supplied in standard tape packing suitable for automated placement.
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