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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Oki Electric
Edited by the Electronicstalk Editorial Team on 2 October 2007

Companies co-operate on volume production

Oki Electric and System Fabrication Technologies are co-operating on the volume production of System-in-Silicon

Oki Electric and System Fabrication Technologies (SFT) have agreed to begin volume production of System-in-Silicon, the next generation architecture with SFT's Sisram memory. 'We are pleased to announce the practical use of System-in-Silicon technology which was jointly developed with Oki, and we expect information devices using this technology to be launched in the market in 2008'.

'This technology enables advances in image processing as it achieves high-speed and low power consumption transmission between large-capacity memory and logic LSI', said Kenji Yoshida, President and CEO of System Fabrication Technologies.

'System-in-Silicon has a larger capacity memory than that of an embedded DRAM, while compared to ASIC + DDR structure systems, it is smaller and has lower power consumption'.

'By consigning the production to Oki, who holds one of the best fine processing and packaging technologies in the world, we are ready to manufacture System-in-Silicon in volume'.

System-in-Silicon, developed by SFT, achieves a high bandwidth and embeds a large-capacity memory while maintaining low power consumption.

Customers are developing applications for image processing in mobile information terminals, and high image quality TVs.

System-in-Silicon is a multi-chip module with Sisram memory and SoC on a silicon interposer, and micro bumps to bond the SoC.

This Sisram has a transmitting speed of 8.5Gbit/s.

The module has a transmission rate equivalent to that of several existing DDR-type SDRAMs, and eliminates issues associated with transmissions between logic and memory at high speed.

Because the transmission rate and memory capacity can be optimised, it also contributes to cost reduction.

'Oki already mass produces wafer-level CSP, which achieves a package size equivalent to an LSI chip', said Takaki Yamada, President of Silicon Microdevice company at Oki Electric Industry.

'By applying Oki's leading edge packaging technology such as micro bumps to SFT's System-in-Silicon technology, we will be establishing a volume production structure for System-in-Silicon, the next generation chips'.

SFT plans to develop new customers with the next generation chip in the growing market including information devices such as mobile phones, portable game consoles, and automotive AV devices.

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