Product category: Exhibitions, Courses, Conferences and Training
News Release from: National Physical Laboratory
Edited by the Electronicstalk Editorial Team on 10 April 2007
Conference to launch
lead-free defect database
The UK National Physical Laboratory will host a Lead-Free Conference and SSTC Meeting on 24th May 2007
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Component stability and reliability in focus
A new NPL studio project will examine how changes in lead-free soldering profiles are affecting the stability and reliability of components
which will include eight technical presentations and the launch of the NPL Industry Defect Database. Performance and reliability are important drivers for design and manufacture of electronic products. Legislation and environmental issues have had a significant impact on interconnection material selection and processing.
Technology drivers are also pushing the requirements for performance and construction.
The conference will answer questions on the key aspects impacting on these factors.
The event is ideally suited for technologists, engineers and designers tasked with improving product reliability and performance.
The meeting will also be valuable to others wishing to gain a more general background in field failures.
The titles of presentations are as follows: 'Improving the prediction of reliability performance of lead-free assemblies'; 'Reliability in high frequency vibration of lead-free solder joints'; 'A new technique for reliability assessment based on power cycling'; 'Corrosion properties of lead-free alloys'; 'Will tin finished components whisker?'; 'Measuring the tin-pest transformation'; 'Thermal management technology developments in the USA'; and 'Reliability of substrates after processing at lead-free soldering temperatures'.
There will also be a tabletop exhibition during this event.
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