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News Release from: National Physical Laboratory
Edited by the Electronicstalk Editorial Team on 21 February 2007
Component stability and
reliability in focus
A new NPL studio project will examine how changes in lead-free soldering profiles are affecting the stability and reliability of components
A new studio project from the National Physical Laboratory aims to bring together interested parties who need to develop an understanding of how changes in lead-free soldering profiles are affecting the stability and reliability of components. European RoHS legislation has lead to increasing processing temperatures and longer dwell times during both the reflow and wavesoldering process.
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Components considered suitable for lead-free soldering have deformed during soldering, leading to misalignment and solder joint reliability problems.
This project will provide industry with a best practice guide on how to minimise the effects on components from the lead-free solder profile.
Likely partners will be: end users wishing to obtain a better understanding of this problem and how to correct it, component manufacturers, solder equipment manufacturers.
Included in the deliverables will be a best practice guide for minimising component damage during lead-free soldering and a report evaluating the effects of lead-free processing on the stability of electronics components.
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