Loaders handle ultra-thin wafers

Nikon NWL200 wafer loaders remove the need to place very thin wafers on the microscope by hand during the post process stage.

The Nikon NWL200 series of wafer loaders is capable of loading the latest ultra-thin 100um wafers for microscopic inspection.

The system provides safe, reliable automated wafer loading and high levels of throughput, suitable for inspection of the next-generation wafers ranging in thickness from 100 to 200um.

The trend towards thinner wafers means greater risk of distortion in the carrier.

The NWL200 series' optimised wafer-sensing functions can accurately detect the shape of thin wafers in the cassette and removes the need to place very thin wafers on the microscope by hand during the post process stage.

Edge chipping detection enables automated macro inspection of all areas with high precision.

Edge defects that cause wafer cracking can be removed promptly.

The wafer carriers are easy to load, as they are located to the front and left of the operator.

The multiarm system allows precise loading and unloading of wafers, increasing the overall efficiency of transfer and wafer exchange and dramatically reducing cycle times.

Fie management functions for carriers and samples enable simple automated inspection.

The NWL200 can be connected to a host computer and built into a network.

The system can transfer data from inspection results online and can be operated remotely.

Combined with Nikon's Digital Sight cameras and NIS-Elements imaging software, the NWL200 offers the optimal inspection system with comprehensive multidimensional image capture, measurement and analysis capabilities.

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