Product category: Communications ICs (Wireless)
News Release from: Freescale Semiconductor | Subject: RFX300-30
Edited by the Electronicstalk Editorial Team on 06 February 2007
3G RF subsystem comes in single
integrated package
Freescale Semiconductor has unveiled the industry's smallest 3G multiband form factor RF subsystem for handset design.
Achieving another milestone in its 3G technology roadmap, Freescale Semiconductor has unveiled the industry's smallest 3G multiband form factor RF subsystem for handset design The new solution combines Freescale's popular and proven Edge and UMTS technologies into a single, integrated package, enabling dramatic board and cost savings
This article was originally published on Electronicstalk on 20 Mar 2001 at 8.00am (UK)
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