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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Freescale Semiconductor
Edited by the Electronicstalk Editorial Team on 13 April 2001

Motorola's 0.13-micron process is
densest CMOS

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A new 0.13-micron CMOS process platform technology will enable Motorola Semiconductor Products Sector (SPS) to build system-on-chip solutions.

A new 0.13-micron CMOS process platform technology will enable Motorola Semiconductor Products Sector (SPS) to build system-on-chip solutions for wireless communication, networking/computing, intelligent home and transportation end markets Called HiPerMOS7 (or "HiP7"), this technology is commonly referred to as 0.13 micron but contains minimum features of 0.07um, and represents the densest, most modular CMOS platform in the industry