Molex launches Stac64 connection system

Molex has introduced the Stac64 connection system, which provides single and multi-pocket PCB solutions to offer a range of circuit sizes and reduce time-to-market by eliminating custom tooling.

The stackable connection system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A.

It also allows the manufacturers to use header assemblies as stand-alone components or to gang multiple headers together to support a range of signal and power needs for devices and modules.

The standard product line, based on the 0.64mm (.025in) terminal, includes 8-, 12-, 16- and 20-circuit connectors in both vertical and right-angle headers supporting low-level signal requirements.

An additional 10-circuit 'power pocket' version, supporting power applications for 1.50 and 2.80mm (.059 and .110in) terminal systems, is available in vertical and right-angle configurations.

The PCB alignment posts ensure all terminals are properly aligned into PCB through-holes during assembly and retain the header to the PCB during assembly and solder processing.

In addition, PCB stand-offs moulded into housings provide additional trace-routing real estate under the headers.

Stac64 is a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications.

The connectors mate to existing wire-harness connectors designed to the USCAR/EWCAP - United States Council for Automotive Research/Electrical Wiring Component Applications Partnership industry footprints.

High-temperature thermoplastic housings withstand infrared (IR) and wave lead-free solder processing per ES-40000-5013 Molex specification.

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