Low insertion force for high-density connectors

High-density metric (HDM) connectors from Molex are designed for board-to-board connection in applications such as networking, high-end computing and telecommunications equipment.

High-density metric (HDM) connectors from Molex are designed for board-to-board connection in applications such as networking, high-end computing and telecommunications equipment.

HDM connectors offer a unique combination of robust mechanical performance, high speed and high-density signal capability.

Signal modules with either 72 or 144 contacts are available.

Pins are offered in either solder tail or press fit styles in increments of 0.5mm to optimise PCB thickness.

Signal modules can be combined with special modules for power, guidance, mounting and coding to create large connectors that can have in excess of 1000 circuits.

A very low insertion force of just 0.35N per pin means that connector mating forces are reasonable, even with such a high contact count.

Each blade within a power module can manage up to 15.0A, thus providing the capability to deliver hundreds of watts for multiple voltage level applications.

Receptacle and header housings are manufactured from tough liquid crystal polymer.

Signal modules have a maximum current rating of 1.0A and maximum voltage rating of 1000V.

Operating temperature range is -55 to +105C.

HDM connectors meet Bellcore requirements.

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