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Product category: IC and Hybrid Processing Equipment
News Release from: Zarlink Semiconductor
Edited by the Electronicstalk Editorial Team on 13 April 2007
Project aims for flexible packaging
technology
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Zarlink has joined a European Commission funded project to develop flexible, highly integrated packages for emerging electronic systems.
Zarlink Semiconductor has joined the SHIFT Project (Smart High-Integration Flex Technologies) Cofunded by the European Commission, the project is developing flexible, highly integrated packages for emerging electronic systems, including medical devices, portable communication tools, smart cards and aerospace applications
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