Product category: Electronics Manufacturing Services
News Release from: MCE Tewkesbury
Edited by the Electronicstalk Editorial Team on 8 August 2006
Investment upgrades manufacture and test
Major investment in manufacturing and test equipment enhances ability to provide 'rapid response' manufacturing of custom electronic components
MCE Tewkesbury has made a major investment in new manufacturing and test equipment to further enhance its ability to provide 'rapid response' manufacturing of custom electronic components. As part of a multi-million-pound package of investments, MCE Tewkesbury has installed automated pick and place equipment, package sealing machinery and an automated mixed signal test facility.
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Ian White, Engineering Manager at MCE Tewkesbury, said: 'For volumes of up to 100,000 units per year, the costs, effort and lead times for a manufacturer to tool up for the production and test of a new electronic component design are often prohibitive'.
'MCE Tewkesbury is building on its established track record in assisting companies with rapid device prototyping by extending its capability to create a flexible assembly and test setup for responsive low to medium volume manufacturing'.
The MCE Tewkesbury investment includes an automated component assembly cell (Model SAM 42) from Amadyne, initially for use in the production of ASICs and multichip modules (MCMs).
The equipment is designed to handle a range of electronic circuit assembly processes including chip on chip, flip chip and eutectic soldering.
It has an adhesive dispenser and has preform handling and stamping capabilities for die attachment of bare chips to substrates and packages.
Further reading
Mixed signal ASICs suit sensing and instruments
MCE Tewkesbury has developed a family of mixed signal ASICs for sensing and instrumentation applications
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Expanded facility creates extra capacity for box build of finished goods and additional SMT assembly lines
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Contract worth approximately US $3.0 million encompasses the design and manufacture of a test strip for a blood monitoring application
It has a placement accuracy of +/-25um and can handle die sizes from 0.5 to 25mm.
MCE Tewkesbury has also recognised the need to control sealing processes for critical applications by investing in specialist sealing equipment that can operate in vacuum and inert atmospheres.
Processes have been developed for high reliability sealing of conventional electronics and microsystems.
The hermetic sealing process for electronic devices is one of the last and most critical stages of the assembly processes in the production of high reliability components.
With the advent of microsystems (such as accelerometers, gyroscopes and detectors) that contain micromachined features, this sealing process has become even more crucial.
Any contamination and moisture needs to be eliminated from the package cavity and, in some cases, the microsystem needs to operate in vacuum for the lifetime of the device.
MCE Tewkesbury's new sealing equipment will permit it to meet these requirements.
Along with the equipment for flexible manufacturing, MCE Tewkesbury has installed and commissioned Eagle Test Systems ETS-600 test equipment for advanced analogue and digital testing.
The equipment has more than 32 analogue pin channels and 192 digital I/O pin channels.
The types of components that can be tested using this equipment include devices for power management, wireless, displays, sensors and detector applications.
The flexibility of the system stems from the ability to accept device test hardware that has been originally developed for other test platforms with minimal device-under-test hardware development.
White added: 'The new test equipment has some special features that enable very accurate voltage, current and timing measurements to be made - measurements which are now required for sophisticated custom electronics'.
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