Prototyping service cuts development costs: News from MCE Tewkesbury

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MCE-Tewkesbury is offering to cut the cost and time involved in moving from prototype to production with new chip designs. A rapid turnaround of prototypes at minimal cost is often a limiting step in the tight schedule for launching new electronic products. In the validation phase of new chip designs, a rapid evaluation of the performance of chips is often required to check the functionality of the device as a packaged component.

However, for the small numbers of devices to be evaluated, the costs, effort and lead times to tool up for production of a new package are often prohibitive.

MCE-Tewkesbury is building on its established track record in assisting companies move from prototype to production by offering its flexible packaging capability for device prototyping together with access to its specialist manufacturing and test equipment.

The company has an extensive set of tooled package designs based on ceramic packages, suitable for evaluation of lead free soldering, which can be made immediately available for customers to carry out rapid device prototyping.

The devices are assembled using established die attach, wire bonding and package sealing processes.

MCE-Tewkesbury also offers rapid turnaround routes to prototype plastic packaged parts.

If access to specific electronic manufacturing and test capabilities is required without the inconvenience of minimum order quantities, MCE-Tewkesbury has an extensive range of equipment and expertise that can be made available to customers.

This includes wafer sawing, prototype assembly and MIL 883 Class B assembly and screening.

The company also provides: high density aluminium wire wedge/wedge bonding; solder, adhesive and glass package sealing; electrical component test for packaged parts and wafers; and dies of all sizes.

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