News Release from: Metcal
Edited by the Electronicstalk Editorial Team on 10 June 2002
Rework system focuses on array packages
The APR-5000 array package rework system is a versatile system offering the repeatability, accuracy and thermal control essential for safe and effective rework of today's leading-edge packages.
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The APR-5000 array package rework system is an advanced, versatile system offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages. Capable of handling boards up to 203 x 254mm (8 x 10in) with a placement accuracy to 0.0254mm (0.001in) and interconnection pitches as low as 0.3mm, the APR-5000 array package rework system is ideal for reworking smaller PCBs such as cellphones and laptop computers. With such assemblies characterised by small, odd shaped boards and advanced packages, the APR-5000 array package rework system delivers the high-end performance required by these products at a very competitive cost.
The APR-5000 is the first of a new range of Metcal array rework systems that address the specific demands of very different market segments, moving away from the inone machine fits allin approach adopted by many rework system manufacturers.
The APR-5000 array package rework system incorporates Metcal's exclusive integral vision system that makes accurate component placement easy to achieve, allowing operators to simultaneously view the topside of the PCB and a superimposed image of the underside of the component.
With micrometer adjustment, images can be accurately aligned in the x, y and theta axes prior to placement.
In addition, integrating the vision system with the APR-5000 array package rework system's software eliminates the need for multiple monitors, thus fully optimising bench space.
As with production reflow technology, the APR-5000 array package rework system uses low airflow forced convection heating.
Metcal's patented reflow head delivers temperature uniformity, ensuring safe and simultaneous reflow of the component being removed without disruption to adjacent parts.
Closed-loop computer-controlled parameters of time, temperature and airflow guarantee process repeatability and precision.
User-friendly software controls the four stages of the reflow profile: preheat, soak, reflow and cooling.
In addition, board temperature can be monitored using the APR-5000 array package rework system's three integrated flying thermocouples, and real-time adjustment can be made to all parameters while the profile is running.
The software is designed to be both instructive and intuitive - walking the engineer through the steps of process development and then instructing the operator to ensure consistent execution of the automatic profile functions.
To guarantee greater temperature uniformity, the PCB itself is centralised relative to the preheater - a design feature unique to the APR-5000 array package rework system.
The system even addresses future process demands, with sufficient power to meet the higher temperatures required for lead-free assemblies.
Another feature of the APR-5000 array package rework system is an integrated placement and reflow head that moves to the correct position for rework, eliminating the need for PCB movement during the process.
Ergonomically designed, the APR-5000 array package rework system uses a minimum of bench space (18 x 28in).
Because the system requires no special wiring and uses self-contained pumps, it can be moved to another bench with no need for fitting or plumbing.
"The APR-5000 array package rework system reflects Metcal's commitment to offering the cutting edge in process technology and solutions, designing and developing systems in response to rapidly changing component technology", explained Michael Gouldsmith, CEO of Metcal.
"The new system builds upon Metcal's extensive SMT experience by addressing the changing technical demands posed by array packages.
We've worked closely with component vendors and our customers over a two year period to develop this rework system to ensure that it meets the higher performance criteria demanded by today's smaller, faster packages and leaner, more cost-effective processes".
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