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Product category: IC and Hybrid Processing Equipment
News Release from: Micralyne
Edited by the Electronicstalk Editorial Team on 07 July 2006
Investment expands MEMS packaging
capabilities
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Micralyne has purchased the SB6e wafer bonder and BA6 aligner system from SUSS MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets.
MEMS specialist Micralyne has purchased the SB6e wafer bonder and BA6 aligner system from Suss MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets Due to increasing production demands over the past year, Micralyne has doubled its employee base and added additional working shifts at its 4400m2 plant