Product category: Electronics Manufacturing Machinery and Materials
News Release from: Master Bond | Subject: EP21ANHT
Edited by the Electronicstalk Editorial Team on 3 December 2004
Epoxy adhesive aids thermal management
A new two-component room-temperature-curing epoxy adhesive features a particularly high thermal conductivity
EP21ANHT is a two-component room temperature curing epoxy adhesive with a thermal conductivity of over 3.17W/mK. It has a forgiving 1:1 mix ratio by weight or volume and has outstanding electrical insulation properties. Master Bond EP21ANHT is recommended for high temperature applications. Service operating temperature range is from -50 to +200C.
This article was originally published on Electronicstalk on 3 December 2004 at 8.00am (UK)
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Thermally conducting resin bonds, coats and pots
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation
Master Bond EP21ANHT has high bond strength to a wide variety of substrates.
It has a low shrinkage, low coefficient of expansion and superb dimensional stability.
Bonds have superior durability and resist water, oil, fuels and many solvents.
Shore D hardness is better than 85 and volume resistivity is better than 100Tohm-cm EP21ANHT is a paste.
It spreads evenly and smoothly.
Cures can be accelerated by the use of heat.
It is available for use in pint, quart, gallon and 5 gallon container kits.
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