Product category: Electronics Manufacturing Machinery and Materials
News Release from: Master Bond | Subject: EP125
Edited by the Electronicstalk Editorial Team on 15 November 2004
Epoxy offers chemical resistance
Master Bond has developed a new two component epoxy system for service above 260C, designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents
Master Bond has developed a new two component epoxy system for service above 260C. Called EP125, this compound is designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents. It offers high bond strength to metallic and nonmetallic surfaces. Typical lap shear strength are in the order of 16.6 to 17.3MPa at ambient temperatures.
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Thermally conducting resin bonds, coats and pots
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation
Silver preforms stick to conducting
A new silver conductive epoxy film and preform system cures very quickly at moderately elevated temperatures and features very high electrical conductivity
After heat aging for 1kh at 260C slightly less than 50% of the original bond strength are retained.
Castings exhibit flexural strength of as high as 100MPa and flexural modulus of more than 3400MPa.
Master Bond EP125 has a convenient mix ratio of 2 to 1 by weight.
It requires an elevated temperature cure and cure cycles can be widely adjusted so as to best meet specific processing needs.
It has a storage stability of 6 months when stored at ambient temperatures in the original closed containers.
EP125 is available in half-pint, pint, quart, gallon and 5 gallon pail kits.
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