Product category: Microprocessors, Microcontrollers and DSPs
News Release from: LSI Europe | Subject: Wafer-level packaging
Edited by the Electronicstalk Editorial Team on 23 May 2005
Wafer-level packaging shrinks SoC
designs
LSI Logic Corporation has released its enhanced wafer-level packaging (WLP) technology for use in ASIC/SoC designs.
LSI Logic Corporation has released its enhanced wafer-level packaging (WLP) technology for use in ASIC/SoC designs Packages produced in this cost-effective, high-performance technology are completely manufactured and tested at the wafer level and then mounted directly onto printed circuit boards or on discrete package substrates
This article was originally published on Electronicstalk on 23 May 2001 at 8.00am (UK)
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