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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: LSI Europe | Subject: G90
Edited by the Electronicstalk Editorial Team on 16 April 2002

SoC processs dips to 90nm

LSI Logic has entered 90nm market with the release of its G90 SoC capability, providing accelerated time to market with increased integration and system-level functionality

LSI Logic has entered 90nm market with the release of its G90 SoC capability, creating new possibilities for customers requiring accelerated time to market with increased integration and system-level functionality. "LSI Logic is focused on our customers' time to market requirements", said Rick Marz, LSI Logic executive vice president of Communications and ASIC Technology.

"The unique value LSI Logic brings to its customer base is supplying the complete SoC solution.

Design projects at the 90nm node are very complex and, through the capabilities of the G90 product, LSI Logic ensures that our market leading customers are able to differentiate their product offerings in the global marketplace".

LSI Logic continues to strategically focus its R and D resources on value-added technology capabilities.

The G90 product is built on a process platform jointly defined by LSI Logic and Taiwan semiconductor manufacturing Corporation (TSMC).

The new process technology platform is a natural extension of the relationship formed between LSI Logic and TSMC on the 130nm joint development process (JDP) announced last year.

The G90 product is compatible with TSMC's 90nm process design rules.

With the foundation of a common set of design rules in place, customers will be able to integrate a broader spectrum of reusable cores, resulting in faster time to market with "Right-First-Time On Time" results.

"The real challenge in the ASIC and SoC space has become the delivery and use of the complete product", said Dr Handel Jones, Chairman and CEO of International Business Strategies.

"Utilising an industry-aligned process, LSI Logic's G90 platform efficiently integrates internally and externally developed reusable intellectual property cores into the LSI Logic design suite.

As a result, LSI Logic is able to enhance its technology strengths as an integrator of reusable intellectual property building blocks into next generation system-on-a-chip designs".

The complete G90 solution, which includes intellectual property, libraries, design tools, memories, advanced packaging and I/Os, can be designed on the 90nm platform using the LSI Logic FlexStream design environment.

Customer engagements with the G90 product will commence this summer with the release of the design libraries.

Designs employing the G90 product will be initially manufactured at TSMC fabrication facilities, commencing in 2003, and at LSI Logic's own manufacturing facilities at a later date.

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