Product category: Electronics Manufacturing Services
News Release from: Labtech
Edited by the Electronicstalk Editorial Team on 23 November 2005
Investment continues at Labtech
A leading manufacturer of microwave printed circuit boards, MMIC packaging solutions and microwave broadband components has invested GBP 800,000 in new equipment in the past year
Labtech, which has its headquarters in Presteigne, Wales, says the investment is essential to stay ahead of competitors and to meet the evolving needs of customers worldwide. Following the purchase of the assets of Filtronic Components' microwave components design and manufacturing facility located in Milton Keynes UK in March this year, Labtech divided its operations into two divisions - Labtech Circuits in Presteigne and Labtech Microwave in Milton Keynes - which employ a workforce of 120.
This article was originally published on Electronicstalk on 23 November 2005 at 8.00am (UK)
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The acquisition has allowed the company to extend its range of microwave manufacturing services to existing and new customers who operate in the defence, satcom and telecommunication markets.
Labtech Microwave, which secured the ISO9001:2000 quality standard in October, offers a range of passive and active microwave components, low noise and multi-octave amplifiers, multi-octave PIN diode switches, DLVAs, thin film microwave circuit manufacture, box-build assembly and build-to-print microwave module assembly and test.
Labtech Circuits manufactures microwave PCBs, MMIC packaging solutions and offers an RF machining service.
Further reading
Gain modules use thin dielectric materials
Labtech has developed a range of low cost, drop-in style and SMD thin dielectric material modules comprising organic substrates on metal carriers with a bonded cover
Amplifiers set the standard for low cost
Thin dielectric material technology is used in a wide range of microwave amplifiers for the defence and civil markets
During 2005, Labtech Circuits has invested in a second UV laser from LPKF, a dedicated precision thin dielectric and inner layer processing facility including a DES (develop, etch and strip) line supplied by Wise of Italy and a new high speed precision exposure system supplied by Automa-tech of France.
'The new equipment improves the processing of thin dielectric layers (0.05mm) and achieves reduced track and spaces (0.05mm), track tolerances (0.013mm), side alignment to 0.005mm and image to panel alignment of +/-0.015mm', explained Labtech's Technical Executive John Priday.
'These are all significant improvements in meeting the technically difficult microwave PCB requirements so prevalent today'.
To meet the challenges of finer PCB features and complex multilayer structures, the company has also taken delivery of the latest Discovery 6 AOI system supplied by Orbotech and made further investments in a Lenz precision drill router and LPKF protomat routers.
'During 2004 and 2005, we have invested GBP 2 million in the acquisition of the Milton Keynes facility together with equipment and processes that will meet the need for integrated multilayer structures and thin dielectric wire bondable softboard PCBs'.
'We will continue to develop and expand our ability to meet this growing demand from our global customers', said Lowther.
'We have some exciting new technologies under development, including MMIC packaging solutions that are now being used by several blue chip customers'.
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