Ceramic substrates provide polished performance

Polished ceramic substrates promise improved edge definition on transmission lines and distributed circuit elements.

Providing design engineers with better edge definition on transmission lines and distributed circuit elements, TT electronics IRC Advanced Film Division has enhanced its thin film microwave circuit capabilities with polished ceramic substrates.

Now available in 0.010in thickness, the polished substrates reduce propagation delay due to shorter signal paths.

According to Applications Engineering Manager Jerry Seams, the polished ceramic results in reduced in-circuit transmission line losses.

"The polished ceramic provides approximately 0.2dB improvement in line loss per inch on 0.025in thick alumina transmission line", said Seams.

"Additionally, the 0.010in thickness of the substrate allows for smaller circuit and element geometries, as well as reduced circuit size".

Other standard finish thicknesses are available in 0.015, 0.020 and 0.025in", Seams continued.

Polished ceramic substrates are available in 0.010, 0.015 and 0.025in thicknesses.

Typical applications for the polished ceramic substrates include routers and switches, servers, computers, and microwave telecomms links, as well as wireless applications.

The substrates are also suitable for RF and microwave applications, including military, radar, avionics, and satellites.

Pricing for the polished ceramic substrates varies with complexity and volume.

Lead time for the devices is from stock to 2 to 6 weeks.

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