News Release from: Interactive Products Corp
Edited by the Electronicstalk Editorial Team on 17 June 2003
Simulator adds more Spice to high-speed designs
Interactive Products Corp has upgraded IFS Pro, its software package specifically developed for design engineers with high-speed analogue simulation requirements.
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Interactive Products Corp has upgraded IFS Pro, its software package specifically developed for design engineers with high-speed analogue simulation requirements involved in PCB, cable, connector, IC and related interconnect media design. As datarates escalate beyond 1Gbit/s, the microwave frequency domain characteristics of the interconnect system become increasingly important. The traditional microwave frequency dependent "port" measurements are scattering or S parameters, impedance or Z parameters, and transmission or T and ABCD parameters.
IFS Pro can perform all these analyses, both quickly and accurately prior to prototyping.
New expanded Spice simulation features include: differential S parameters - frequency domain (before only single S); and single and differential eye patterns.
Also a new expanded report format includes xtk xfx coefficient format reports, making it convenient to create HSpice models directly from the IFS Pro report.
This provides for a very comprehensive field solver and Spice modeling capabilities all in one easy-to-use tool.
Subsequently, IFS Pro can be used as a rapid turnkey one-stop solution suite enabling users to go from geometry through to an electromagnetic analysis, resulting in a comprehensive report, and then simulate with Spice in both time and frequency domains, as well as import the universal Spice model into any other Spice simulator products.
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