Click on the advert above to visit the company web site

Product category: Memory Devices and Modules
News Release from: Intel Corporation | Subject: StrataFlash Cellular Memory (M18)
Edited by the Electronicstalk Editorial Team on 21 November 2005

Next-generation Flash drives handset applications

Intel has begun volume shipments of the industry's first 90nm multilevel cell (MLC) NOR Flash memory device

The new Intel StrataFlash Cellular Memory (M18) delivers faster performance, higher density and lower power consumption than the previous 130nm version to meet the increasing demand for feature-rich cellphones equipped with cameras, colour screens, web browsing and video. 'Flash memory is one of the driving technologies in enabling the next generation of cellphone applications', said Darin Billerbeck, Vice President and General Manager, Intel Flash Products Group.

'The M18 delivers to cellular designers the unique combination of performance, density and low power required for today's phones'.

'Moreover, the M18 is built on Intel's reliable and cost-effective fifth generation MLC technology and 90nm process lithography'.

The M18 offers the fastest read speeds in the industry, enabling the new Flash memory to operate at the same bus frequency as next-generation cellular chipsets - up to 133MHz.

This speeds user application execution because the interaction between the chipset and memory operation is faster than in the 130nm version.

With write speeds of up to 0.5Mbyte/s, the M18 supports 3Mpixel cameras and MPEG4 video.

OEMs benefit from lower production costs that result from factory programming speeds of up to three times faster than prior 130nm versions.

The M18 consumes one-third the energy to program and about half the energy to erase than prior generation products, and offers the new deep power down operation mode, all for improved battery life.

The M18 also increases the NOR Flash density reach, with single chip solutions of 256 and 512Mbit and standard stacked package solutions up to 1Gbit.

Intel's industry-leading standard stacks combine NOR and RAM in multiple bus architectures, and improve OEM time to market and supply-line flexibility.

Intel is working across the cellular ecosystem to help customers reduce integration time, increase performance and optimise reference design platforms.

According to Billerbeck, Intel has worked with leading cellular chipset vendors such as ADI, Philips, Infineon and MediaTek in addition to such operating system vendors as symbian and MontaVista to help ensure their products are ready for the 90nm M18 product family.

Intel has design wins with eight cellular OEMs, including NEC and Sony Ericsson.

'The performance, high density and value of Intel StrataFlash Cellular Memory (M18) are a great match for Sony Ericsson's feature-rich phones', said Peter Carlsson, Vice President and Head of Sourcing, Sony Ericsson.

To help designers speed integration and delivery of new handsets, Intel is providing the next generation of Intel Flash Data Integrator (Intel FDI) royalty-free software.

Intel FDI v7.1 offers an open architecture for easy integration of a Flash file system with real-time operating systems and three new features: mountable USB, multiple-volume support and RAM buffer support.

• Intel Corporation: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• NEW
• Electronicstalk Home Page

Search the Pro-Talk network of sites

Put your news on Electronicstalk  |   Advertise  |   Get the free Electronicstalk newsletter
Electronicstalk Home  |   About Electronicstalk  |   Copyright © 2000-2007 Pro-Talk Ltd, UK