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Product category: Memory Devices and Modules
News Release from: IDT | Subject: Advanced memory buffer (AMB) devices
Edited by the Electronicstalk Editorial Team on 29 August 2005

Advanced memory buffers work together

Interoperability has been achieved between fully buffered dual inline memory modules (FB-DIMMs) that use both IDT and Intel Corp advanced memory buffer (AMB) devices

This will enable designers of memory modules, servers and workstations to choose FB-DIMM platforms with confidence, knowing that the system will remain flexible and can be upgraded as bandwidth requirements grow. 'We are pleased to have achieved this significant technology milestone, which will help our customers develop next-generation, high-bandwidth server and workstation systems', said Tom Kao, Director of Marketing for the IDT DIMM support products group.

'Through world-class technology delivery, IDT has consistently demonstrated leadership and commitment to the DIMM market'.

'Early to market with our AMB devices, we are committed to building the AMB ecosystem and will continue to establish strategic partnerships to enable customers to take advantage of advanced technologies'.

'Interoperability among AMBs is the essential next step in making the benefits of FB-DIMM a reality', said Jim Pappas, Director of Initiative Marketing for Intel's Digital Enterprise Group.

'This milestone demonstrates that interoperability is now possible and also provides designers a look at the design tools necessary to meet next-generation server requirements'.

AMB devices are an essential building block for next-generation, high-bandwidth applications, such as servers and workstations, which require increased performance and large memory capacities.

A key attribute of the FB-DIMM channel architecture is the high-speed, serial, point-to-point connection between the memory controller and modules on the channel.

The AMB chip located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip and receives or forwards it to the next DIMM or memory controller.

This unique channel structure alleviates buffer latency issues common in registered DIMM technology, enabling designers to use a large number of DIMMs within a single system.

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