Product category: Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: NF260
Edited by the Electronicstalk Editorial Team on 5 December 2005
Novel no-flow underfill
wins technology award
Indium Corporation has received the Global Technology Award for its NF260 no-flow underfill
Sponsored by Global SMT and Packaging magazine, the award recognises product excellence and innovation in semiconductor packaging and electronics assembly. It was presented last month at Productronica in Munich, Germany. NF260 is the world's first reworkable, air reflowable, Pb-free no-flow underfill.
This article was originally published on Electronicstalk on 5 December 2005 at 8.00am (UK)
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It is designed for chip scale package (CSP) and BGA or flip-chip assemblies using a single reflow process.
NF260 offers both a fluxing and underfilling capability for the chip while providing increased reliability and environmental protection.
Designed for Pb-free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing.
The underfill curing is completed in one reflow pass and no post-cure is required.
NF260 reduces costs when compared with capillary flow underfills, and also achieves higher yields.
Two trends are converging and driving the need for more advanced PCB assembly materials: higher lead-free soldering temperatures make no-flow underfilling more difficult, whereas greater solder rigidity makes underfilling more necessary; and portability demands greater crack-resistance in drop tests, hence a greater need for underfilling.
Indium reckons NF260 satisfies both these needs.
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