Product category: Electronics Manufacturing Machinery and Materials
News Release from: Indium Corporation of America | Subject: Pb-free soldering products at APEX
Edited by the Electronicstalk Editorial Team on 3 February 2004
Pb-free soldering products on show at APEX
Indium Corp will be exhibiting a number of Pb-free soldering products at APEX on Booth 1347.
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Indium Corp will be exhibiting a number of Pb-free soldering products at APEX on Booth 1347. NC-SMQ230 is a Pb-free solder paste for SMT. Currently over 5,000,000 mobile phones have been produced with NC-SMQ230.
This solder paste is an air reflow, no-clean material specifically formulated to accommodate the high processing temperatures required by Sn/Ag/Cu and Sn/Ag Pb-free alloy systems.
NC-SMQ230 provides outstanding printing performance along with extended stencil life and tack time to handle the rigors of today's manufacturing environment.
Pb-Free solder paste made with NC-SMQ230 has recently received the Frost and Sullivan Product Innovation award.
PK-001 and PK-002 flip-chip epoxy fluxes are designed especially for use with Sn62 and Sn 63 eutectic solders.
PK-002 is specially designed for Pb-free applications.
PK-001 and PK-002 are fast curing, halide-free, no-clean fluxes which can be used for flip-chip or CSP soldering processes.
PK-001 and PK-002 have a stable thermoset residue, and are compatible with standard underfill materials, conformal coatings, and most finishes and coatings.
They are also environmentally friendly.
Eutectic AuSn solder finds use in critical applications such as high-reliability medical, aerospace, and military applications, in die-attach and lid sealing, or as a braze alternative.
Its relatively high melting point and exceptional joint strength make the alloy useful for certain applications.
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