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Product category: Microprocessors, Microcontrollers and DSPs
News Release from: Hitachi Europe | Subject: HJ931201BP
Edited by the Electronicstalk Editorial Team on 16 December 2002
Tiny module combines MCU with SDRAM and
Flash
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A novel family of system-in-package modules uses a three-layer stack structure to combine a high-performance microprocessor with multiple memory chips in a single package.
Hitachi's three-layer stacked HJ931 series is a 'system-in-package' (SiP) or multichip module (MCM) that uses a three-layer stack structure to incorporate a high-performance SuperH microprocessor and multiple memory chips in a single package The first product in the new series, the HJ931201BP, incorporates the SH7705, a 64Mbit synchronous DRAM (SDRAM), and a 16Mbit Flash memory
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