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Product category: Electronics Manufacturing Machinery and Materials
News Release from: Henkel Loctite Adhesives
Edited by the Electronicstalk Editorial Team on 16 January 2006

Toleno to address SMTA in Toronto

Note: A free brochure or catalogue is available from Henkel Loctite Adhesives about its services. Click here to request a copy.

Dr Brian Toleno will speak at the upcoming meeting of the Surface Mount Technology Association's Toronto, Canada Chapter

Well-respected for his leadership in materials science and dedication to the electronics industry, Henkel's Dr Brian Toleno will speak at the upcoming meeting of the surface mount technology Association's (SMTA) Toronto, Canada Chapter. Speaking on a variety of issues as they relate to underfill technology, Dr Toleno will share basic information, such as the definition of underfills and their function, as well as more detailed data regarding design rules, reliability and standards.

'We are delighted that Dr Toleno is speaking to the SMTA's Toronto Chapter', says Bev Christian, VP of Technical Programmes for SMTA's Toronto Chapter.

'One of the SMTA's charters is continuing education and we are honoured that Dr Toleno will share his vast materials expertise with our members'.

In his current role as Application Engineering Team Leader at the Electronics Group of Henkel, Dr Toleno is responsible for overseeing applications work for the company's electronics assembly products, including solder paste, liquid flux, conformal coating, potting, surface mount adhesives, board level underfill and thermally conductive adhesives.

He has a BS in chemistry from Ursinus College and received his PhD in analytical chemistry from Penn State University.

Prior to joining Henkel, Dr Toleno managed the failure analysis laboratory at the electronics manufacturing Productivity Facility (EMPF).

He is an active member of the SMTA, has served as the Programme Chair for the 2005 IEMT, and currently serves as the IPC's Underfill Handbook Committee (J-STD-030) Chairperson and Co-chair of the Solder Paste Standards Committee (J-STD-005).

In addition, Dr Toleno has developed a course on failure analysis for SMTA, has authored numerous technical features for trade journals and peer reviewed publications and has written two chapters for electronic engineering handbooks on adhesives and materials.

Dr Toleno will speak at the SMTA Toronto Chapter's meeting on 18th January 2006. Request free introductory details about products from Henkel Loctite Adhesives....

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