Flexible Futurebus connector system

A Harwin product story

Edited by the Electronicstalk editorial team Jul 3, 2002

Harwin's new Futurebus connector system is a modular 2.00mm grid system for high density, high-speed signal board-to-backplane applications for datarates of 0.622Gbit/s.

Harwin's new Futurebus connector system is a modular 2.00mm grid system for high density, high-speed signal board-to-backplane applications for datarates of 0.622Gbit/s.

The connectors were developed in a joint strategic alliance with Starconn, and are designed for use in telecomms, networking and high-end computing applications.

The Futurebus system offers design flexibility with PCB receptacles and headers that are end to end stackable.

Vertical male headers and right-angle female receptacles are available in one-, two-, four- and eight-module formats with four- and five-row options.

Compliant press fit leads offer fast, solderless application to printed circuit boards.

Housings are manufactured from high temperature liquid crystal polymer (LCP) whilst contacts are selective gold/tin plated for reliability and performance.

The connectors have a current rating of 1.0A per pin, an initial contact resistance of 25mohm and operate between -55 and +125C.

Components are packaged in tubes.